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作 者:孙磊[1] 陈明和[1] 谢兰生[1] 张亮 朱建东[3] SUN Lei;CHEN Minghe;XIE Lansheng;ZHANG Liang;ZHU Jiandong(College of Mechanical&Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,China;School of Mechanical and Electrical Engineering,Jiangsu Normal University,Xuzhou 221116,China;State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China)
机构地区:[1]南京航空航天大学机电学院,南京210016 [2]江苏师范大学机电工程学院,徐州221116 [3]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001
出 处:《焊接学报》2018年第8期47-50,131,共5页Transactions of The China Welding Institution
基 金:国家自然科学基金资助项目(51475220);江苏省"六大人才高峰"高层次人才资助项目(XCL022);江苏省"青蓝工程"中青年学术带头人计划;新型钎焊材料与技术国家重点实验室开放课题资助项目(郑州机械研究所SKLABFMT201503);南京航空航天大学博士学位论文创新与创优基金(BCXJ18-06);江苏省研究生科研与实践创新计划资助项目(KYCX18_0318)
摘 要:通过机械混合的方法,制备Sn1.0Ag0.5Cu-x Al复合钎料.采用DSC、STR-1000型微焊点强度测试仪及SEM,研究了纳米铝颗粒对低银Sn1.0Ag0.5Cu钎料组织与性能的影响.结果表明,微量纳米铝颗粒的添加对钎料的熔化温度影响较小,其熔点均在226.9~229.0℃之间.随着纳米Al元素含量的增加,钎料的润湿角逐渐减小,力学性能逐渐增加,当纳米Al元素的添加量为0.1%时,焊点的拉伸力达到最大,为7.1 N.此外,Sn1.0Ag0.5Cu-0.1Al钎料的内部组织得到显著细化,焊点界面金属间化合物的生长也得到明显抑制,主要归因于纳米颗粒对金属间化合物生长的吸附作用.Snl.0Ag0.5Cu-xAl composite solders were prepared by mechanically mixing method.The effect of nano A1 particles on the microstructure and properties of Snl.0Ag0.5Cu solder were investigated by diffemetial scanning calorimetry,STR-1000 micro-joint strength tester and SEM.The results showed that adding nano A1 particles does not cause a considerable change in the melting temperature.All samples ranged from 226.9 to 229°C.With the addition of nano A1 particles,the wetting angle was decreased and mechanical property was increased.When the addition of nano A1 particles was 0.1%,the pull force of solder joint reached the maximum,which was 7.1 N.In addition,the microstructure of Snl.OAgO.5Cu-0.1A1 solder was significantly refined,and the thickness of interfacial intermetallic compounds(IMC)was effectively inhibited,which may attributed to the adsorption of nanoparticles.
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