全金属化应变不敏感FBG温度传感器特性研究  

Characteristics of strain-insensitive FBG temperature sensor via metallic packaging

作　　者：戎丹丹 张钰民 杨润涛[1] 骆飞[1] 祝连庆[1,2,3] RONG Dan-dan;ZHANG Yu-min;YANG Run-tao;LUO Fei;ZHU Lian-qing(Beijing Engineering Research Center of Optoelectronic Information and Instruments,Beijing Information Science and Technology University,Beijing 100016,China;Key Laboratory of Modern Measurement Control Technology,Ministry of Education,Beijing 100192,China;Beijing Key laboratory of Optoelectronic Test Technology,Beijing Information Science and Technology University,Beijing 100192,China)

机构地区：[1]北京信息科技大学光电信息与仪器北京市工程研究中心,北京100016 [2]现代测控技术教育部重点实验室,北京100192 [3]北京信息科技大学光电测试技术北京市重点实验室,北京100192

出　　处：《激光与红外》2018年第9期1133-1138,共6页Laser & Infrared

基　　金：教育部"长江学者与创新团队发展计划"项目(No.IRT-16R07);北京市优秀人才培养资助项目(No.2015000020124G074)资助

摘　　要：为了解决传统胶封光纤布拉格光栅(Fiber Bragg Grating,FBG)传感器存在严重胶蠕变和老化问题,提出基于一步超声波焊接的全金属化封装FBG传感器方法,采用有限元分析方法进行传感器的应变不敏感结构设计并制作了该温度传感器进行实验验证。测试结果表明,该方法制作的特定封装形式的FBG传感器对轴向应变不敏感,温度灵敏度达到39.16 pm/℃,是封装前裸光栅的4倍,线性度超过0.999,具有较好的重复性,并且温度从20℃改变到100℃的动态测量响应时间小于30 s。该金属化封装FBG温度传感器的工艺简单,制作周期短,其优异的温度传感特性在高精度、高可靠性传感监测领域具有广泛的应用前景。The phenomenon of creep and aging is ubiquitous in the traditional FBG sensors packaged by adhesive.To solve the problem,a kind of metallic-packaging FBG sensor based on one-step ultrasonic welding was proposed.Strain-insensitive structure of temperature sensor was designed by finite element analysis method,and the performance of temperature sensor was tested.The experimental results show that the metallic-packaging FBG sensor is insensitive to axial strain.And the temperature sensitivity reaches 39.16 pm/℃,which is as 4 times as that of bare FBG.The fitted linearity exceeds 0.999,and it has excellent repeatability.Furthermore,the dynamic response time is less than 30 s from 20℃to 100℃.The metallic-packaging FBG temperature sensor had the advantages of simple process,short production cycle,and excellent temperature sensing characteristics.It has extensive prospect in the field of high-precision and high-reliability sensing.

关 键 词：金属化封装 应变不敏感 光纤布拉格光栅 超声波焊接 

分 类 号：TN929.11[电子电信—通信与信息系统]