ChCl-urea-ZnO-Cu_2O低共熔溶剂电镀铜锌合金  

Electroplating of Zn-Cu alloys in ChCl-urea-ZnO-Cu_2O deep eutectic solvents

作　　者：刘海[1] 徐存英[1] 唐杰 朱啸林 王祥 黄梦婷 华一新[1] 张启波[1] LIU Hai;XU Cunying;TANG Jie;ZHU Xiaolin;WANG Xiang;HUANG Mengting;HUA Yixin;ZHANG Qibo(College of Metallurgical and Energy Engineering,Kunming University of Science and Technology,Kunming 650093,Yunnan,China)

机构地区：[1]昆明理工大学冶金与能源工程学院,云南昆明650093

出　　处：《化工学报》2018年第10期4402-4408,共7页CIESC Journal

基　　金：国家自然科学基金项目(21263007);国家重点基础研发展计划项目(2014CB643404)~~

摘　　要：以ChCl-urea-ZnO-Cu_2O低共熔溶剂为电解质在343 K镍基体上电沉积制备得到了铜锌合金镀层。伏安曲线测试表明在沉积过程中,镍基体能够诱导金属Zn发生欠电位沉积,从而实现了Cu-Zn合金的共沉积。同时研究了沉积电势对镀层成分和形貌的影响,结果表明:沉积电势由-0.85 V (vs Ag)增加到-1.3 V(vs Ag)时,合金镀层中Zn原子百分数从0升高到76.29%。在沉积电势为-1.10^-1.15V范围内,Zn原子百分数为12.5%~20.81%时,镀层平整致密,颜色为金色,达到仿金镀的效果。Cu-Zn alloy was electrodeposited on nickel substrate in ChCl-urea-ZnO-Cu2O deep eutectic solvents at 343 K.The voltammetric curve test shows that cluring the deposition process,the nickel matrix can induce the underpotential deposition of the metallic Zn,thus achieving the co-deposition of the Cu-Zn alloy.The effects of deposition potential on composition,surface and morphology of Cu-Zn alloy coatings were also studied.The results indicate that when deposition potential negatively shifts from?0.85 V(vs Ag)to?1.30 V(vs Ag),the Zn content in the alloy increases from 0 to 76.29%(atom).When deposition potential is located in the range of?1.10-?1.15 V,the content of Zn is in the range of 12.5%(atom)-20.81%(atom),the alloy coating is golden.Thus,the imitating Gold plating can be achieved in ChCl-urea-ZnO-Cu2O deep eutectic solvents by controlling a suitable deposition potential.

关 键 词：铜锌合金 低共熔溶剂 共沉积 仿金镀 膜 沉积物 电化学 

分 类 号：TB383[一般工业技术—材料科学与工程]