银粉及银导电浆料制备技术的研究进展  

Research progress on preparation technology of silver powder and silver conductive paste

作　　者：杨洪霞 黄立达 朱敏蔚 蔡依群 YANG Hongxia;HUANG Lida;ZHU Minwei;CAI Yiqun(Chengdu Hongming Electronics Co.,Ltd,Chengdu 610051,China;Shanghai Precision Metrology&Test Research Institute,Shanghai 201109,China;Shanghai Institute of Space Power Sources(SISP),Shanghai 200245,China)

机构地区：[1]成都宏明电子股份有限公司,四川成都610051 [2]上海精密计量测试研究所,上海201109 [3]上海空间电源研究所,上海200245

出　　处：《电子元件与材料》2018年第10期1-7,共7页Electronic Components And Materials

摘　　要：银导电浆料是发展电子元器件的基础之一,其制造技术的核心包括银粉的制备和银浆的调浆两部分。文章结合近年来银粉及银导电浆料领域文献及研究工作情况,综述了各形貌银粉的制备方法,且着重介绍了化学还原法;阐述了银浆的组成、制备方法以及各成分对浆料性能的影响;并提出了银导电环保浆料和复合浆料的发展趋势。The silver conductive paste is one of the bases for developing electronic components,and the core manufacturing techniques of silver conductive paste includes preparation of silver powder and size mixing processing.Based on the literature and research work in the field of silver powder and silver conductive paste in recent years,the preparation methods of silver powder with different shapes are summarized,and the chemical reduction method is introduced emphatically.The composition of the silver paste,the preparation method and the influence of each component on the properties of the paste are described.And the development tendency of silver conductive environmental protection paste and composite paste are also put forward.

关 键 词：银粉 银导电浆料 综述 银导电环保浆料 复合浆料 发展趋势 

分 类 号：TM241[一般工业技术—材料科学与工程]