超声波作用下钎焊石墨与铜的界面特征  

Characteristics of brazing interface of graphite with copper under action of ultrasonic wave

作　　者：俞伟元[1] 刘庭宾 陈岳[1] 尚江旭 YU Wei-yuan;LIU Ting-bin;CHEN Yue;SHANG Jiang-xu(State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metal,Lanzhou Univ.of Tech.,Lanzhou 730050,China)

机构地区：[1]兰州理工大学省部共建有色金属先进加工与再利用国家重点实验室,甘肃兰州730050

出　　处：《兰州理工大学学报》2018年第5期19-23,共5页Journal of Lanzhou University of Technology

基　　金：国家自然科学基金(E050803;51465032)

摘　　要：大气下以超声波作为钎焊的辅助工具,采用Sn4Ag1Cu4Ti钎料对紫铜与石墨焊接.采用SEM和EDS进行微观组织分析,并对施加超声波后紫铜与石墨界面钎焊接头处微观组织的形态特点和界面层进行研究.结果表明:在超声波的驱动作用下,钎料中的锡元素与铜侧扩散的铜元素在界面处生成Cu_3Sn反应层;而在石墨侧由于钎料内部含有活性元素的Sn_xTi_y金属间化合物通过施加超声波后溶解,液态Ti元素扩散到界面但并未发现Ti元素在石墨的偏聚也没有明显的TiC反应层生成.Taking the ultrasonic wave as an auxiliary means for brazing,the red copper and graphite were brazed together with Sn4Ag1Cu4Ti as solder in atmospheric environment.The microstructure of the brazed joint was analyzed with scanning electron microscopy(SEM)and energy dispersive spectrometry(EDS),and the feature of microstructural morphology of the interface between red copper and graphite at brazing joint and interface layer were investigated on condition of ultrasonic wave application.It was shown by the investigation that under the action of the ultrasonic wave driving,a reaction layer of Cu 3Sn would form from the element of tin in the solder and the element of copper diffused at the copper side of the interface.At the graphite side,however,the liquefied element of Ti would diffuse onto the interface due to the dissolution of the intermetallic compound Sn x Ti y containing active elements under the action of ultrasonic wave application,biased aggregation of element of titanium onto the graphite would not be found,and would be no obvious formation of TiC reaction layer,also.

关 键 词：超声波钎焊 SnAgCuTi 石墨 紫铜 反应层 

分 类 号：TG454[金属学及工艺—焊接]