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作 者:张少春 张燕[1] 张国强 谈隆旺 ZHANG Shao-chun;ZHANG Yan;ZHANG Guo-qiang;TAN Long-wang(School of Mechatronic Engineering and Automation,Shanghai University,Shanghai 200072)
机构地区:[1]上海大学机电工程与自动化学院,上海200072
出 处:《中国集成电路》2018年第11期53-57,共5页China lntegrated Circuit
摘 要:使用化学气相沉积方法在镍箔上制备了竖直取向的碳纳米纤维。使用SEM与TEM表征了碳纳米纤维的形貌与微观结构。开发了一种大面积竖直碳纳米纤维无损转移的方法,表征结果显示转移前后纤维微观结构无明显变化。散热性能测试结果显示随着电功率增大散热效果增强。当所加功率达到2W时,降温效果可以达到5℃。证明了竖直碳纳米纤维具有应用于集成电路封装散热的潜力。Vertically aligned carbon nanofibers have been synthesized by chemical vapor deposition method over a range of growth conditions.The microstructure of nanofibers was characterized by SEM and TEM.A new transfer method was developed to transfer large area VACNFs film to the target surface without changing nanostructure.A thermal test system was set up for measuring thermal dissipation capability.VACNFs-attached paraffin wax exhibited an improved thermal performance that an over 5℃decrease of temperature can be reached when the applied power is 2W compared with reference pure paraffin wax.
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