微孔填充工艺在HTCC金属化方面的研究  

Application of Micro-hole Filling Process in Metallization of HTCC

作　　者：王慧[1] 王亚君[1] WANG Hui;WANG Yajun(The 45^th Research Institute of CETC,Beijing 100176,China)

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176

出　　处：《电子工业专用设备》2018年第6期33-36,共4页Equipment for Electronic Products Manufacturing

摘　　要：介绍了基于印刷方式下的微孔填充工艺的HTCC金属化技术,详细介绍了印刷填孔工艺在HTCC金属化的应用及国内印刷填孔设备。并将此印刷填孔工艺广泛应用于HTCC行业的陶瓷金属化,取得了很好的实际应用效果。In this paper,the HTCC metallization technology based on the micro-hole filling process under printing mode is introduced,and the application of the printing hole filling process in HTCC metallization and the domestic printing and filling hole equipment are described in detail.And this printing and filling hole technology is widely used in ceramic metallization of HTCC industry,and has achieved very good practical application results.

关 键 词：HTCC金属化 印刷填孔工艺 填孔设备 

分 类 号：TN605[电子电信—电路与系统]