铜镀层工艺参数优化的正交实验研究  

Orthogonal Experimental Research on Optimization of Process Parameters of Copper Electroplating

作　　者：王晓丽[1,2] 顾海 周昭昌 WU Rudder 黄大志 周天源[6] WANG Xiaoli;GU Hai;ZHOU Zhaochang;WU Rudder;HUANG Dazhi;ZHOU Tianyuan(Jiangsu Key Laboratory of Function Control Technology for Advanced Materials,Huaihai Institute of Technology,Lianyungang 222005,China;Jiangsu Key Laboratory of 3D Printing Equipment and Application Technology,Nantong 226002,China;Department of Mechanical Engineering,National Taiwan Ocean University,Keelung Taiwan 20224,China;National Institute for Material Science,Tsukuba 3050047,Japan;Marine Resources Development Institute of Jiangsu,Huaihai Institute of Technology,Lianyungang 222005,China;School of Computer Engineering,Huaihai Institute of Technology,Lianyungang 222005,China)

机构地区：[1]淮海工学院江苏省先进材料功能调控技术重点实验室,连云港222005 [2]江苏省3D打印装备及应用技术重点建设实验室,江苏南通226002 [3]国立台湾海洋大学机械与机电学系,中国台湾基隆20224 [4]日本国立材料物质研究所,日本筑波3050047 [5]淮海工学院江苏省海洋资源开发研究院,江苏连云港222005 [6]淮海工学院计算机工程学院,江苏连云港222005

出　　处：《电镀与精饰》2018年第12期19-25,共7页Plating & Finishing

基　　金：江苏省先进材料功能调控技术重点实验室资助项目(JKLFCTAM1705);淮海工学院自然科学基金项目(Z2017007);江苏省3D打印装备及应用技术重点建设实验室(南通理工学院)开放基金资助项目(2018KFKT05);南通市3D打印技术及应用重点实验室资助项目(CP12016002);连云港市科技项目(CG1608);江苏省重点建设学科资助项目(苏教研〔2016〕9号).

摘　　要：电镀加工技术是非传统的加工工艺,镀层性质的好坏依赖于电解质的组成、pH、温度、电流密度等因素。基于稳健性设计理论和变量分析,利用L_9正交表实验,研究了pH和温度对镀层性质的影响。分析了pH和温度对重量、厚度和粗糙度的影响,得出了电镀加工参数的最优值,优化的工艺条件为:pH=1、温度≤40℃。优化后的电镀铜层晶粒均匀致密,表面平整,质量较佳。通过XRD图谱和高解析光学显微镜分析表面形貌证明了优化的可靠性。该设计为电沉积加工技术的深度研究提供了指导作用。Electroplating processing technology is an unconventional processing technology.The properties of the coating depend on the composition of the electrolyte,pH,temperature,current density and other factors.Based on the robust design theory and variable analysis,the effects of pH and temperature on the properties of the coating were investigated with L9 orthogonal experiments.The effects of pH and temperature on weight,thickness and roughness were analyzed,and the optimum values of electroplating processing parameters were obtained.The optimized process conditions were as follows:pH=1,temperature≤40°C.The optimized electroplated copper layer was uniform with dense crystal grains,and the surface was flat with good quality.The reliability of the optimization was demonstrated by XRD pattern and high resolution optical microscopy analysis of the surface topography.This design can provide guidance for in-depth research in electrodeposition processing techniques.

关 键 词：电镀 镀层重量 厚度 粗糙度 正交设计 

分 类 号：TG174.441[金属学及工艺—金属表面处理]