PCB上化学镀锡工艺的应用研究进展  

Application research progress of PCB chemical tin plating process

作　　者：段富良 王梅 达刘生 Duan Fuliang;Wang Mei;Da Liusheng(Yunnan Tin Co.,Ltd.,Gejiu 661000,China)

机构地区：[1]云南锡业股份有限公司,云南个旧661000

出　　处：《云南化工》2018年第10期29-30,共2页Yunnan Chemical Technology

摘　　要：近年来,我国科技技术发展十分迅速,越来越多的先进科技技术逐渐得到了开发和应用,为各行业的飞速发展起到了积极的推进作用。PCB是先进科技技术发展下的产物,是电子类元件的重要部分,也是电子类元件功能体现的保障,为了保证其具有良好的功能,需要在PCB上进行化学镀锡。针对PCB上化学镀锡工艺的应用研究进展进行分析研究。In recent years,Science and technology development in our country is very rapid,More and more advanced technology gradually obtained the development and application of science and technology,As the rapid development of industry has played a positive role in promoting.PCB is the product of advanced science and technology development,and an important part of electronic components,As well as the guarantee for electronics components function reflect,In order to ensure that it has good function,Electroless tin on the PCB,Based on PCB application research progress of chemical tin plating process are studied.

关 键 词：PCB 化学镀锡工艺 研究进展 

分 类 号：TQ153.13[化学工程—电化学工业]