超高层大尺寸高频高速厚背板工艺开发  

Progress research on thick backplane with ultra-high layers, over-size, high-speed, high-frequency

作　　者：焦其正 王小平 纪成光 Jiao Qizheng;Wang Xiaoping;Ji Chengguang

机构地区：[1]生益电子股份有限公司,广东东莞523127

出　　处：《印制电路信息》2018年第12期50-58,共9页Printed Circuit Information

基　　金：东莞市东城街道重大科技项目(2016年度)

摘　　要：文章主要研究了超高多层大尺寸厚背板的工艺难点,如高多层大尺寸背板对准度控制、厚背板钻孔、厚板高厚径比电镀深镀能力。通过对比不同方式的铆合定位方法,优化销定位孔设计,采用导电控深+CCD钻孔的等大对钻工艺,采用脉冲电镀和小电流直流电镀,以及不同类型背钻stub制作方法等关键技术的研究,成功制作最高层数58层,最大板厚8.6 mm,最大尺寸610 mm×1143 mm的背板。The main difficulties in manufacturing process of the over-size&ultra-high layer thick backplane were studied in detail,such as registration control,thick backplane drilling,high aspect ratio platting,and so on.The key technology was studied.Different rivet positioning methods were compared.The location hole design of Pin-lam was optimized.It chose CBD+CCD drilling method which drill from double side with same diameter drill bit and multi-wave stairs pulse platting and low current DC plating.Different back drill stub processes were tested also.As a result,the over-size(Max size:24”×45”)&ultra-high layer(Max layer:58)thick(Max thickness:8.6mm)backplane were manufactured successfully.

关 键 词：销钉定位层压 定位孔优化 导电控深+(电荷耦合定位系统)钻孔 小电流直流电镀 

分 类 号：TN41[电子电信—微电子学与固体电子学]