微波混合集成电路射频裸芯片表面封装研究  

Research of Surface Packaging of RF Bare Chip for Microwave Hybrid Integrated Circuit

作　　者：蒯永清 董昌慧 李益兵 沈磊 邱莉莉 KUAI Yongqing;DONG Changhui;LI Yibing;SHEN Lei;QIU Lili(Nanjing Electronic Co. Ltd., Nanjing 210049, China)

机构地区：[1]南京恒电电子有限公司,江苏南京210049

出　　处：《电子工艺技术》2018年第6期342-345,共4页Electronics Process Technology

摘　　要：对微波混合集成电路射频裸芯片表面封装工艺进行了研究。研究结果发现,通过对关键工艺点的控制,具有良好性能的EGC-1700无色防潮保护涂层可以实现在X波段的应用。对射频裸芯片的表面采用EGC-1700无色防潮保护涂层涂覆的低噪声放大器进行了湿热试验和高低温贮存试验,发现其关键指标如噪声系数曲线和增益曲线与试验前的走势具有较好的一致性。说明EGC-1700无色防潮保护涂层对X波段的射频裸芯片表面防护是有效的。Surface packaging of RF bare chip for microwave hybrid integrated circuit were studied. The results of the study showed that EGC-1700 colorless electronic grade coating with good performance can be applied in X band through the control of key process points. Humid heat tests and thermo cycling tests of the amplifier assembled RF bare chip coating EGC-1700 were conducted. The results show that the critical index such as the noise factor curve and the gain curve are quite consistent with the data before testing. The surface protection EGC-1700 colorless electronic grade coating on RF bare chip is effective in X band.

关 键 词：射频裸芯片 EGC-1700 X波段 噪声系数 增益 

分 类 号：TN60[电子电信—电路与系统]