焊锡膏印刷工艺新技术研究  

Study on New Technology of Solder Paste Printing

作　　者：李霄 Li Xiao(Sichuan Jiuzhou Electric Group Co.,Ltd.,Mianyang Sichuan 621000)

机构地区：[1]四川九洲电器集团有限责任公司,四川绵阳621000

出　　处：《现代工业经济和信息化》2018年第17期27-29,共3页Modern Industrial Economy and Informationization

摘　　要：焊膏喷印作为一种新兴技术,对SMT生产的发展有促进作用。从封闭式印刷和焊膏喷印两方面探讨了新型焊膏模板与焊膏印刷技术,并就自动光学检测及焊膏检测系统分析研究了焊膏检测技术。As a new technology, solder paste spray printing promotes the development of SMT production. The new solder paste template and solder paste printing technology are discussed from two aspects of closed printing and solder paste spray printing. The automatic optical detection and solder paste detection system are analyzed and studied.

关 键 词：焊膏喷印 电子组装 SMT 焊膏印刷 

分 类 号：TG425.1[金属学及工艺—焊接]