TMA法测试印制板玻璃化温度的影响因素探讨  

Discussion on the factors affecting the glass transition temperature of printed board by TMA method

作　　者：王璎琰 张永华[1] 周莹 Wang Yingyan;Zhang Yonghua;Zhou Ying

机构地区：[1]无锡江南计算技术研究所,江苏无锡214083

出　　处：《印制电路信息》2019年第2期25-29,共5页Printed Circuit Information

摘　　要：测量玻璃化温度(T_g)是印制板来料检验、过程监控以及失效分析过程中的一个重要步骤。文章结合热机械分析法(TMA)测量的基本原理,分别考察了升温速率、探头负荷、样品状态等因素对测量印制板玻璃化温度的影响,并分析了不同测试结果产生的原因。Measuring the glass transition temperature(Tg)is an important step in the process of incoming inspection process monitoring and failure analysis of printed boards. Combined with the basic principles of thermomechanical analysis (TMA) measurement, this paper examines the influence of factors such as the heating rate, probe load, sample state on the measurement of the glass transition temperature of the printed board, and the reasons for the different test results were analyzed.

关 键 词：热机械分析法 玻璃化温度 印制板检测 

分 类 号：TN41[电子电信—微电子学与固体电子学]