高频混压HDI板制作工艺研究  

Study on the technology of high frequency mixed pressure HDI plate

作　　者：郑晓蓉 曾祥福 周刚 Zhen Xiaorong;Zeng Xiangfu;Zhou Gang

机构地区：[1]广东科翔电子科技有限公司,广东惠州516081

出　　处：《印制电路信息》2019年第2期48-54,共7页Printed Circuit Information

摘　　要：高频混压PCB产品伴随通讯技术、电信行业的发展应运而生。本产品由Rogers 4350高频材料与FR4半固化片材料混压而成,产品孔径小、内层芯板较薄,采用高频材料制作2种互连盲孔,是一种高端技术含量的新类型产品。With the development of communication technology and telecommunication industry, high frequency mixed- pressure PCB products have emerged. This product is made of ROGERS 4350 high frequency material and FR4 Pp material. It has small aperture and thin inner core plate. Two kinds of interconnection blind holes are made of high frequency materials. It is a new type product with high technology content.

关 键 词：高密度板 高频高速 混压 

分 类 号：TN41[电子电信—微电子学与固体电子学]