用于微电子封装的电子胶粘剂及其涂覆工艺  

Electronic Adhesive and Fluid Dispensing Technology for Micro-Electronics Packaging

作　　者：王志 秦苏琼 谭伟 WANG Zhi;QIN Suqiong;TAN Wei(Lianyungang HHCK Electronic Materials Co. Ltd,Lianyungang 222047,China)

机构地区：[1]连云港华海诚科电子材料有限公司,江苏连云港222047

出　　处：《电子工业专用设备》2019年第1期11-16,共6页Equipment for Electronic Products Manufacturing

摘　　要：介绍了电子胶粘剂及其涂覆工艺,其所涉及的工艺有大量式点胶(Mass Dispensing),接触式点胶(Contact Dispensing),非接触式点胶,总结了各种分配技术的优缺点,指出了不同分配技术的适用情况,提出电子胶粘剂涂覆工艺技术方案。This paper introduces the electronic adhesives and their fluid dispensing technology. The technologies involved are Mass Dispensing, Contact Dispensing and Non-contact Dispensing. The advantages and disadvantages of various distribution technologies are summarized, the application of different distribution technologies is pointed out, and the fluid dispensing of electronic adhesives is put forward.

关 键 词：电子胶粘剂 接触式点胶 非接触式点胶 

分 类 号：TN604[电子电信—电路与系统]