电子行业用反应型聚氨酯热熔胶的研究进展  

Research progress of reactive hot melt polyurethane adhesives for electronic industry

作　　者：胡树 孙立民 张利利 郭辉 HU Shu;SUN Li-min;ZHANG Li-li;GUO Hui(Research and Development Department,Polytren Material Science and Technology Co.,Ltd.,Shenzhen,Guangdong 518052,China;Technology Development Center,Shenzhen Selen Science&Technology Co.,Ltd.,Shenzhen, Guangdong 518054,China)

机构地区：[1]聚纶材料科技(深圳)有限公司研究开发部,广东深圳518052 [2]深圳市新纶科技股份有限公司科技创新中心,广东深圳518054

出　　处：《粘接》2019年第1期41-45,共5页Adhesion

基　　金：深圳市战略新兴产业发展专项资金资助项目(JSGG20160229145748550)

摘　　要：介绍了电子行业用反应型聚氨酯热熔胶(PUR)的特点和优势。从反应型聚氨酯热熔胶的原材料及制备工艺、电子行业用反应型聚氨酯热熔胶、光/湿双固化和封端改性等几方面论述了国内外的技术进展。最后对电子行业用PUR的发展进行了展望。The main characteristics and advantages of reactive hot melt polyurethane adhesives( PUR) for electronic industry were introduced. The domestic and abroad research progress in recent years, including the raw materials and preparation process of PUR, PUR for electronic industry, UV/moisture dual-curable PUR and silane modified PUR, was discussed. Finally, the development direction of PUR adhesives for electronic industry was p rospected.

关 键 词：双固化 聚氨酯 粘接强度 反应型热熔胶 

分 类 号：TQ436.4[化学工程]