数据中心热环境瞬态CFD模拟与分析  

Transient CFD Simulation and Analysis of Data Center Thermal Environment

作　　者：马昕宇 王军 杜垲[1] MA Xinyu;WANG Jun;DU Kai(School of Energy and Environment,Southeast University,Nanjing,Jiangsu 210096,China;Jiangsu Phoenix Data Co.,Ltd,Nanjing,Jiangsu 210037,China)

机构地区：[1]东南大学能源与环境学院,江苏南京210096 [2]江苏凤凰数据有限公司,江苏南京210037

出　　处：《制冷技术》2019年第1期61-66,共6页Chinese Journal of Refrigeration Technology

摘　　要：本文建立了一种适用于瞬态CFD模拟的服务器机架简化模型,以南京某数据中心为例对机房空调系统进行瞬态数值模拟,分析了服务器功率上升、空调冷却失效、供冷恢复后以及降低送风温度的不同工况下,数据机房内热环境的瞬态变化过程。结果表明:服务器热容和功率是影响瞬态过程中温度变化响应的重要因素。在服务器功率提高工况下,平均机架出口温度随时间呈指数增长,前10 min温升较快,随后增长趋于平缓。在空调冷却失效工况下,平均机架出口温度随时间线性增长,对于所述机房,机柜功率为6 kW时,平均机架出口温度将在7 min内超过45℃。A simplified transient CFD simulation model of server racks is established in this paper. A data center in Nanjing is taken as an example to simulate the transient state of the air conditioning system. The transient process of the thermal environment in a computer room is analyzed under the conditions of server power rise, cooling failure, cooling recovery and air supply temperature reduction. The results show that, the heat capacity and power of the server are important factors that influence the temperature response. With the increase of server power, the average rack outlet temperature increases exponentially with time. The temperature rises rapidly in the first 10 min, and then the growth tends are flat. When the air conditioning cooling fails, the average rack outlet temperature increases linearly with time. For the described computer room, when rack power is 6 kw, the average rack outlet temperature increases over 45 ℃ within 7 min.

关 键 词：数据中心 热环境 瞬态模拟 冷却失效 

分 类 号：TU83[建筑科学—供热、供燃气、通风及空调工程]