基于Comsol的上游泵送机械密封增材制造仿真研究  

Simulation Study on Additive Manufacturing of Upstream Pumping Mechanical Seal Based on Comsol

作　　者：张凡 纪仁杰[1] 任维波 张瑞霞[2] 张峰[2] 成卫海 ZHANG Fan;JI Renjie;REN Weibo;ZHANG Ruixia;ZHANG Feng;CHEN Weihai(College of Mechanical and Electronic Engineering,China University of Petroleum (East China),Qingdao 266580,China;The Petroleum Engineering Institute of Sinopec Shengli Oilfield,Dongying 257001,China)

机构地区：[1]中国石油大学(华东)机电工程学院,山东青岛266580 [2]中国石油化工股份有限公司胜利油田分公司石油工程研究院,山东东营257001

出　　处：《电加工与模具》2019年第A01期59-63,共5页Electromachining & Mould

基　　金：国家自然科学基金面上项目(51675535);中央高校基本科研业务费专项资金资助项目(17CX02058);"十三五"装备预研领域基金重点项目(6140923030702)

摘　　要：以沉积环形为模型,通过Comsol仿真软件对上游泵送机械密封环进行增材仿真。根据对流场和电场的分析,建立了相应的增材制造模型,并结合阳极内冲液方法,实现了对圆环电沉积在浸没和无浸没两种环境下流体分布和电流密度仿真,分析得出两种环境下沉积的不同状态。研究为固定形貌电沉积提供有效的理论支持,为进一步研究上游泵送机械密封的增材制造工艺机理奠定基础。The article simulates the additional material process of the upstream pumping mechanical seal ring by building the model from deposition ring shape using Comsol method. Based on the simulated analysis of flow field and electric field by internal flush method,the fluid distribution and electric current density in the process of ring electrodeposition could be obtained under the conditions of immersion and non-immersion,and the different electrodeposition states under opposite conditions are analyzed. The research in this paper provides effective theoretical support for specified shape electrodeposition and lays a foundation for further research on additive manufacturing mechanism of upstream pumping mechanical seal.

关 键 词：上游泵送机械密封 增材制造 Comsol 仿真分析 

分 类 号：TG66[金属学及工艺—金属切削加工及机床]