液态金属小流道热沉流动与传热性能研究  

Investigation of the Flow and Thermal Performance of Liquid Metal Mini-channel Heat Sink

作　　者：杨小虎[1,2] 谭思聪 刘静 YANG Xiao-Hu;TAN Si-Cong;LIU Jing(Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics,Technical Institute of Physics and Chemistry,Chinese Academy of Sciences,Beijing 100190,China;School of Future Technology,University of Chinese Academy of Sciences,Beijing 100049,China;Department of Biomedical Engineering,School of Medicine,Tsinghua University,Beijing 100084,China)

机构地区：[1]中国科学院理化技术研究所低温工程学重点实验室,北京100190 [2]中国科学院大学未来技术学院,北京100049 [3]清华大学医学院生物医学工程系,北京100084

出　　处：《工程热物理学报》2019年第4期916-925,共10页Journal of Engineering Thermophysics

基　　金：中国科学院院长基金;中国科学院理化技术研究所所长基金

摘　　要：本文对液态金属小流道热沉的流动与传热性能进行了数值模拟研究,并建立了其近似理论分析模型。其中,流动阻力模型充分考虑了沿程流动压降和进/出口局部压力损失;热阻模型则涵盖了热沉面积延伸带来的扩展热阻,底板传导热阻,对流换热热阻以及流体热容热阻。文章重点分析了热沉进/出口尺寸以及流动结构布置方式对热沉性能的影响,并利用流动阻力理论模型探究了局部压力损失对热沉整体压力降的影响.对比分析了液态金属冷却和水冷的性能,并利用热阻模型详细分析了各热阻分项随流量的变化规律,以便于深刻认识两者各自的特点.定量对比了理论模型和数值计算模型的差别,为多参数优化设计提供了理论依据.本文构建的液态金属小流道热沉在1 kPa的驱动压差下(流量1 L/min)总热阻为0.14℃/W,适合于应对10~2 W/cm^2(热源面积1 cm^2)量级高热流密度芯片冷却.In this paper,the flow and thermal performance of a liquid metal mini-channel heat sink is investigated, both by numerical simulation and theoretical analysis. A 3D conjugate flow and thermal resistance model is developed for the heat sink;where, the frictional drag and local pressure loss are considered in the flow resistance model;spreading resistance,conduction resistance,convection resistance and capacity resistance are involved in the thermal resistance model. The influences of the inlet/outlet size and flow configuration on the performance of the heat sink under different flow rate are evaluated. The characteristics and differences of liquid metal cooling and water cooling are intuitively and quantitatively compared. The results obtained by the developed 3D approximate theoretical model shows good agreement with the numerical results. The thermal resistance of the heat sink optimized by the model can be as low as 0.14 ℃/W under the flow rate of 1 L/min, while the pressure drop is only 1 kPa, which shows good potential for cooling of high power chips.

关 键 词：液态金属 小流道热沉 高热流密度 流动与传热 理论模型 数值模拟 

分 类 号：TK123[动力工程及工程热物理—工程热物理]