电化学沉积金锡合金及其性能研究  

Study on Electrochemical Deposition of Gold and Tin Alloys and Its Properties

作　　者：杨俊锋 梁嘉伟 丁明建 冯毅龙 庄严 YANG Jun-feng;LIANG Jia-wei;DING Ming-jian;FENG Yi-long;ZHUANG Yan(Aurora Technologies Co., Ltd, Guangzhou 510288, China)

机构地区：[1]广州天极电子科技有限公司,广东广州510288

出　　处：《广州化学》2019年第2期59-63,共5页Guangzhou Chemistry

基　　金：广东省科技计划项目(2016A010119087)

摘　　要：以柠檬酸金钾和氯化亚锡为主要原材料,配制Au^+及Sn^(2+)浓度分别为8 g/L和10 g/L的溶液,在不同电流密度下通过电化学沉积获得金锡合金镀层。通过X-射线衍射(XRD)、扫描电子显微镜(SEM)、微区元素成分分析(EDS)及差示扫描量热分析(DSC)等手段对镀层的物相、微观形貌、金含量及熔融性能进行了系统研究。结果表明,电流密度0.030～0.045 mA/mm^2为最佳电流密度范围,可获得熔融温度约280℃、焊接性能良好的金锡合金镀层。A kind of solution with Au+ and Sn2+ 8 g/L and 10 g/L are prepared by using gold potassium citrate and tin chloride as the main raw materials. Gold and tin alloy depositions are obtained under different current densities.The phase composition, microscopic structure, gold content and melting properties of depositions have been investigated systematically by XRD diffraction, scanning electron microscope(SEM), energy dispersive spectroscopy(EDS) and differential scanning calorimetry(DSC). The results show that the best current density range is 0.030~0.045 m A/mm2, gold and tin alloy depositions with good welding property and melting temperature about 280℃ can be obtained.

关 键 词：金锡合金 电化学 电流密度 

分 类 号：TQ153.2[化学工程—电化学工业]