TiZrNiCu-B/Ti60润湿性及其与TiBw-TC4钎焊研究（英文）  

Wettability of TiZrNiCu-B/Ti60 System and Its Brazing with TiBw-TC4 Composite

作　　者：胡胜鹏[1,2] 陈祖斌 雷玉珍 宋晓国 康佳睿[2] 曹健 唐冬雁 Hu Shengpeng;Chen Zubin;Lei Yuzhen;Song Xiaoguo;Kang Jiarui;Cao Jian;Tang Dongyan(State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China;Shandong Provincial Key Laboratory of Special Welding Technology,Harbin Institute of Technology at Weihai,Weihai 264209,China;Department of Chemistry,Harbin Institute of Technology,Harbin 150001,China)

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001 [2]哈尔滨工业大学(威海)山东省特种焊接技术重点实验室,山东威海264209 [3]哈尔滨工业大学化学系,黑龙江哈尔滨150001

出　　处：《稀有金属材料与工程》2019年第3期701-710,共10页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51775138,51505105,U1537206);International Science&Technology Cooperation Program of China(2015DFA50470)

摘　　要：采用座滴法在真空下研究了硼含量对TiZrNiCu/Ti60润湿性的影响,且在940℃保温10 min条件下实现了其与TiBw-TC4的钎焊。通过SEM、XRD以及剪切实验研究了界面显微组织及剪切力学性能。结果表明,添加B元素可以与Ti原位合成TiBw,从而细化界面的显微组织。当B质量分数为0.3%时,TiBw-TC4/TiZrNiCu-B/Ti60接头的最大抗剪切强度为177 MPa,比无B的接头强度高65%。然而,过量的B含量使TiZrNiCu-B在Ti60合金基体上产生大量的TiBw,导致润湿性恶化,在钎焊接头形成微孔和未焊合区域,从而使抗剪切强度下降。The connection between the boron content and the wettability of TiZrNiCu/Ti60 system was studied by a sessile drop method of elevating and maintaining isothermal process under vacuum, and TiBw-TC4 composite was successfully brazed to Ti60 alloy using TiZrNiCu-B filler alloy at a brazing temperature of 940 ℃ for 10 min. The contact angles of TiZrNiCu/Ti60 alloy substrate with the corresponding interfacial microstructure, the interfacial microstructures and shear fractures of brazed joints were studied using SEM, EDS and XRD, and the influence of B content on interfacial microstructure and joining properties was also investigated. The results show that the added B element can react with Ti to in-situ synthesize TiB whiskers(TiBw), which results in a relative refinement of microstructure. And when the content of B is 0.3 wt%, the maximum shear strength of TiBw-TC4/TiZrNiCu-B/Ti60 joint is 177 MPa, which is 65% higher than that of the joints brazed without B. However, the excessive B worsens the wetting behavior of TiZrNiCu-B on Ti60 alloy substrate, resulting in the microvoids and disconnected areas in the brazed joint, and the shear strength decreases inevitably.

关 键 词：润湿 TiZrNiCu-B钎料 Ti60合金 TiBw-TC4复合材料 接头性能 

分 类 号：TG454[金属学及工艺—焊接]