Ti/Ni多层复合材料界面扩散行为研究  

Interface Diffusion Behavior of Ti/Ni Multilayer Composites

作　　者：张志娟[1] 张兵[1,2] 尚筱迪 王秋雨 王乐 王快社[1,2] Zhang Zhijuan;Zhang Bing;Shang Xiaodi;Wang Qiuyu;Wang Le;Wang Kuaishe(Xi'an University of Architecture and Technology,Xi'an 710055,China;National & Local Engineering Researching Center for Functional Materials Processing,Xi'an 710055,China)

机构地区：[1]西安建筑科技大学,陕西西安710055 [2]功能材料加工国家地方联合工程研究中心,陕西西安710055

出　　处：《稀有金属材料与工程》2019年第3期923-930,共8页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51541404);镍钴资源综合利用国家重点实验室开放课题(301170504);西安建筑科技大学基础研究基金项目(JC1507)

摘　　要：针对累积叠轧5道次制备的Ti/Ni多层结构复合材料试样进行热处理,采用光学显微镜和扫描电镜分析方法,对复合材料的显微组织、界面结构和扩散反应层厚度等进行观察分析,结合动力学理论研究了Ti/Ni界面的扩散行为。结果表明:试样经过累积叠轧5道次轧制后,Ti/Ni界面未发生扩散;在(550～750℃)/(0.5～8 h)热处理后,Ti/Ni界面发生扩散,扩散层厚度与保温时间呈幂函数关系,与加热温度呈指数关系;随着热处理温度的升高,Ti-Ni扩散层的生长方式由650℃以下的体扩散控制逐渐转变为晶界扩散控制。通过计算和验证得到采用累积叠轧5道次制备的Ti/Ni多层复合材料的Ti/Ni界面固相反应层生长动力学方程为:y=1.7043×10~4 exp(-78202/RT)t^(1.2009-0.0008T)。The samples of Ti/Ni multilayered composites fabricated by 5 cycles ARB(accumulative roll bonding) were treated with different heat treatments. The microstructure, interface structure and thickness of Ti/Ni interface diffusion layer were analyzed by optical microscope(OM) and scanning electron microscopy(SEM) combined with the dynamic theory to study the diffusion behavior of Ti/Ni interface. The results show that the Ti/Ni interface does not diffuse during accumulative roll bonding processes. After heat treatment of(550~750 ℃)/(0.5~8 h),diffusion occurs in the Ti/Ni interface;the thickness of diffusion layer is a power function of the experimental time, while the thickness is an exponential function of temperature. With the increase of heat treatment temperature, the growth of Ti-Ni diffusion layer transforms gradually from the body diffusion control under 650 ℃ to grain boundary diffusion control. Through the calculation and verification we can get the dynamics equation of reaction layer growth of Ti/Ni interface of Ti/Ni multi-layer structure composite material produced by 5 cycles ARB:y=1.7043×10^4 exp(-78202/RT)t^1.2009-0.0008 T .

关 键 词：Ti/Ni多层复合材料 热处理 界面扩散行为 动力学理论 

分 类 号：TB331[一般工业技术—材料科学与工程]