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作 者:李胜宇 胡欢 李娴[1] 范立 韦雪莲 黄亚文[1] 杨军校 Shengyu Li;Huan Hu;Xian Li;Li Fan;Xuelian Wei;Yawen Huang;Junxiao Yang(State Key Laboratory for Environment,Friendly Energy Materials,Faculty of Material Scienceand Engineering ,Southwest University of Science and Technology ,Mian yang 621010,China)
机构地区:[1]环境友好能源材料国家重点实验室西南科技大学材料科学与工程学院,四川绵阳621010
出 处:《高分子材料科学与工程》2019年第4期134-141,共8页Polymer Materials Science & Engineering
摘 要:通过分别在2种含有苯并环丁烯单元的基体树脂——4-(1’,1’-二甲基-1’-乙烯基)硅基苯并环丁烯均聚物(P(4-DMVSBCB))及4-(1’,1’-二甲基-1’-乙烯基)硅基苯并环丁烯和苯乙烯共聚物(P(4-DMVSBCB-r-St))中添加苯并环丁烯改性的笼型倍半硅氧烷(BCB-POSS),制备出介电性能优异的BCB树脂/POSS复合材料。通过红外研究了复合材料的固化过程,并通过阻抗分析、热重分析、邵氏硬度研究了不同BCB-POSS含量对复合材料的介电性能、耐热性能及硬度的影响。结果表明,在固化过程中,POSS表面的BCB四元环开环与基体树脂中的BCB四元环发生Diels-Alder反应形成共价键;复合材料的介电常数随着BCB-POSS的添加量增加而降低,当添加量达到40%时,介电常数可降低至2.35;BCB-POSS的添加使材料的耐热性能和硬度都有提高,并随着BCB-POSS的添加量的增加而上升。Benzocyclobutene-modifiedsilsesquioxane (BCB-POSS) was introduced into two kinds of matrix resin containing benzocyclobutene units. The homopolymer of 4-(1',1'-dimethyl-1'-vinyl) silylbenzocyclobutene(P(4-DMVSBCB)) and the copolymer of 4-(1',1'-dimethyl-1'-vinyl) silylbenzocyclobutenewith styrene (P(4-DMVSBCB-r-St)) were prepared to form high performance polymers. Benzocyclobutene(BCB) resin/silsesquioxane(POSS) composites were prepared with excellent dielectric properties.The curing processes of the compostites were studied by FT-IR to show an obvious behavior. The dielectric properties, heat resistance and its hardness were studied by impedance analyzer,TGA and Shore Duromete with the effects of different BCB-POSS contents in the composites, respectively. The results show that during the curing process, the Diels-Alder reaction occurs between BCB four-membered rings on POSS with BCB four-membered rings in the matrix resin to form a cross-linking covalent bond. The dielectric constant of the composites decreases with the addition of BCB-POSS.When the amount of BCB-POSS is about 40%, the dielectric constant reduces to 2.35. At the same time, the introduce of BCB-POSS can increase the heat resistance and the hardness of the cured composites.
关 键 词:苯并环丁烯树脂 倍半硅氧烷 复合材料 介电性能 热稳定性
分 类 号:TB332[一般工业技术—材料科学与工程]
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