高温钎料的研究进展及展望  

Research Progress and Prospects of High Temperature Solder

作　　者：赵月 章强 王丹 刘金鑫 孙晓林 魏景傲 ZHAO Yue;ZHANG Qiang;WANG Dan;LIU Jin-xin;SUN Xiao-lin;WEI Jing-ao(Linyi University, Linyi Shandong 276000,China)

机构地区：[1]临沂大学,山东临沂276000

出　　处：《科技视界》2019年第7期97-98,82,共3页Science & Technology Vision

摘　　要：着重讲述了贵金属基钎料、 Cu基钎料、 Ti基钎料及Ni基钎料四类高温钎料,概述了这四类钎料的最新研究成果及发展状况,并分析了每种钎料的优缺点及应用范围,同时为了提高高温钎料的应用范围及突破创新,对高温钎料的研究方向进行了展望。In this paper, four kinds of high-temperature solders,including precious metal based solder, Cu based solder, Ti based solder and Ni based solder, are emphatically described, summarizes the latest research achievements and development status of these four kinds of solders, and analyzes the advantages, disadvantages and application scope of each kind of solder.

关 键 词：高温钎料 贵金属基钎料 Cu基钎料 Ti基钎料 Ni基钎料 

分 类 号：TG454[金属学及工艺—焊接]