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作 者:余利泉 莫德锋[1,3] 王镇 龚海梅 YU Li-quan;MO De-feng;WANG Zhen;GONG Hai-mei(State Key Laboratory of Transducer Technology, Shanghai Institute of Technical Physics,Chinese Academy of Sciences, Shanghai 200083, China;School of Information Science and Technology, ShanghaiTech University, Shanghai 201210, China;University of Chinese Academy of Sciences, Beijing 100049, China)
机构地区:[1]中国科学院上海技术物理研究所传感技术国家重点实验室,上海200083 [2]上海科技大学信息科学与技术学院,上海201210 [3]中国科学院大学,北京100049
出 处:《红外》2019年第4期1-11,共11页Infrared
基 金:中国科学院青年创新促进会资助项目(2018274)
摘 要:红外焦平面探测器在航空、航天、军事等多个领域具有广泛应用。我国亟需发展大面阵、轻量化和高可靠性的红外焦平面探测器及其杜瓦组件。介绍了国内外红外探测器组件的冷平台材料选用情况,包括Fe-Ni膨胀合金、低膨胀高导热合金和新型陶瓷等。总结了红外焦平面探测器热失配应力的来源以及减小热失配应力的解决方案。最后给出了红外探测器研制过程中的冷平台材料选取建议以及在红外焦平面探测器组件发展趋势下需要重点研究的相关技术。Infrared focal plane detectors are widely used in aviation, aerospace, military and other fields. It is urgent to develop large format, lightweight and high reliability infrared focal plane detectors and their dewar assembly in China. The selection of cold platform materials for infrared detector assemblies at home and abroad is analyzed, including Fe-Ni expansion alloy, low expansion alloys with high thermal conductivity, new ceramic materials, and so on. The source of thermal mismatch stress in infrared focal plane detectors and the solution to reduce thermal mismatch stress are summarized. Finally, some suggestions on the material selection of cold platform during the development of infrared detector are given, while involving the key technologies which should be studied under the development trend of infrared focal plane detectors assembly.
分 类 号:TN214[电子电信—物理电子学]
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