局部电镀的研究  

Study on Partial Plating

作　　者：危灿[1] 肖颖[1] Wei Can;Xiao Ying(Patent Examination Cooperation Guangdong Center Of The Patent Office, CNIPA, Guangzhou 510700, China)

机构地区：[1]国家知识产权局专利局专利审查协作广东中心

出　　处：《广东化工》2019年第10期89-90,共2页Guangdong Chemical Industry

摘　　要：本文概述了局部电镀技术研究进展,包括包扎法、仿形夹具法、液面控制法、涂覆绝缘层法、刷镀、点镀,比较了不同局部电镀方法的优缺点。局部电镀不必在工件上全面电镀,减少了电镀液的浪费,降低了成本,可实现工件的局部修复,可制得多颜色、多图案的镀层,其应用遍及国民经济的各个领域。This paper summarizes the research progress of partial plating technology, including wraping, clamping, liquid level controlling, coating, brush plating and spot plating, and compares the advantages and disadvantages of different partial plating methods. The partial plating does not need to be fully plated on the workpiece, the waste of the plating solution is reduced, the cost is reduced, the partial repair of the workpiece can be realized, and the coating of many colors and patterns can be made, and the application covers various fields of the national economy.

关 键 词：局部电镀 包扎法 仿形夹具法 液面控制法 涂覆绝缘层法 刷镀 点镀 

分 类 号：TQ[化学工程]