“半胱氨酸亚金”配合物的置换化学镀金工艺  

Immersion Electroless Gold Plating Technology of “Aurous-Cysteine” Complex

作　　者：侯晨曦 李德良 陈易 钟迪元 罗洁 HOU Chenxi;LI Deliang;CHEN Yi;ZHONG Diyuan;LUO Jie(Colege of Environmental Sciences and Engineering,Central South University of Forestry and Technology,Changsha 410004,China;Hunan Rongweiye Electronic Materials Technology Co.,Ltd.,Changsha 410007,China)

机构地区：[1]中南林业科技大学环境科学与工程学院,湖南长沙410004 [2]湖南荣伟业电子材料科技公司,湖南长沙410007

出　　处：《电镀与环保》2019年第3期26-28,共3页Electroplating & Pollution Control

基　　金：国家自然科学基金(20976201);湖南省自然科学基金(07JJ6156);国家教委留学回国人员资助项目(2004184)

摘　　要：合成了一种半胱氨酸亚金的无氰、腈金化合物盐。以该亚金配合物为研究平台,开展了ENIG(化镍金)工艺研究。得到的最佳化学镀金工艺参数为:温度45~65℃,pH值1.5~2.5,亚金2.0~2.5 g/L,配体[Lig]10~25 g/L。在此条件下,可以获得晶粒细小均匀、结合力好的化学镀金层。A cyanide-free aurous-cysteine compound salt was synthesized,and this aurous complex was used as a research platform to carry out the research on ENIG process.The optimal process parameters of electroless gold plating were determined as follows:temperature 45~65℃,pH value 1.5~2.5,aurous 2.0~2.5 g/L,ligand[Lig]10~25 g/L.Under these conditions,the obtained electroless gold coating was fine and uniform,and with good adhesion.

关 键 词：半胱氨酸 亚金 化镍金 

分 类 号：TQ153[化学工程—电化学工业]