论扫描声学显微镜在电子封装中的应用  

The Study of Scanning Acoustic Microscope on the IC Packaging

作　　者：刘玲玲 谭伟 范丹丹 崔亮 刘红杰 段杨杨 LIU Lingling;TAN Wei;FAN Dandan;CUI Liang;LIU Hongjie;DUAN Yangyang(Jiangsu HHCK advanced Materials Co.,Ltd,Lianyungang 222047,China)

机构地区：[1]江苏华海诚科新材料股份有限公司,江苏连云港222047

出　　处：《电子工业专用设备》2019年第3期42-45,共4页Equipment for Electronic Products Manufacturing

摘　　要：探讨了在使用扫描声学显微镜对IC封装体扫描时,对扫描图形中的黑点产生的原因及判定方法以及芯片底部芯片胶分层的波形情况及其扫描方法进行了讨论,结果表明,气孔和未分散的橡胶是造成扫描图中黑点的原因,芯片胶底部的分层需要由透射图形结合波形图才能准确判定。In this paper,the root cause of the dark spot in CSAM picture,the waveform between the die and the die attach are discussed,The results show that the voids and undispersed rubber in the epoxy molding compound are the root causes of dark spots in the scanning image.The delamination between the die and die attach needs to be determined accurately by the transmission picture combining with the waveform.

关 键 词：扫描声学显微镜 气孔 分层 

分 类 号：TN407[电子电信—微电子学与固体电子学]