钢/钨扩散连接技术研究进展  

Review on Diffusion Bonding Between Tungsten and Steel

作　　者：代野[1] 戴明辉[1] 牛犇 陈大军[1] 李忠盛[1] DAI Ye;DAI Minghui;NIU Ben;CHEN Dajun;LI Zhongsheng(Southwest Technology and Engineering Research Institute,Chongqing 400039,China;Chengdu Military Representative Office of the Army Aeronautical Department,Chengdu 610036,China)

机构地区：[1]西南技术工程研究所,重庆400039 [2]陆军装备部航空军事代表局驻成都地区航空军事代表室,成都610036

出　　处：《兵器装备工程学报》2019年第5期205-209,共5页Journal of Ordnance Equipment Engineering

基　　金：装备预研领域基金项目(61409230503)

摘　　要：概述了钢/钨扩散连接技术,指出钢/钨直接连接的存在问题以及国内外连接技术中采用中间层情况,综述了采用不同中间层连接钢/钨的工艺参数以及连接接头的界面特征和性能特点,表明利用扩散焊技术连接钢与钨可获得较好的结合性能,展望了钢/钨扩散连接的发展前景。The diffusion bonding technology between tungsten and steel was introduced.The main problem of directly bonded tungsten/steel and the interlayer used in recent advances was mentioned.Interface topography and mechanical properties of tungsten/steel joints diffusion bonded with different interlayer and bonding parameters were summarized.Finally,the development prospects of diffusion bondingbetween tungsten and steel have was considered.

关 键 词：扩散连接 钢/钨 中间层 界面特征 力学性能 

分 类 号：TG456.9[金属学及工艺—焊接]