图形电镀铜工艺中针孔原因分析  

Reason analysis of pores in pattern plating process

作　　者：李成 王一雄 Li cheng;Wang Yixiong

机构地区：[1]深圳市迅捷兴科技股份有限公司

出　　处：《印制电路信息》2019年第6期34-38,共5页Printed Circuit Information

摘　　要：图形电镀铜锡工艺产生的针孔不良主要是气泡型针孔,气泡型针孔产生必须有3个条件:一有微小气泡产生,二有障碍物吸附气泡,三有饱和的电镀溶液不溶解气泡。搅拌方式为打气的龙门式电镀铜锡线解决针孔的唯一出路就是避免电镀溶液成为饱和溶液。The main pores in pattern plating is bubble pores. There must be three conditions to form bubble pores: the first is micro bubble generation;the second is barrier adsorb bubble;the third is saturated electroplate solution which can’t dissolve bubble. For Longmen pattern plating which use stir method to pump, the only way to eliminate pores is to avoid electroplate solution to turn into saturated solution.

关 键 词：图形电镀铜 针孔 电镀溶液 饱和 搅拌 

分 类 号：TN41[电子电信—微电子学与固体电子学]