基于红外热成像的回流焊炉测温仪设计  

Design of reflow furnace temperature measuring instrument based on infrared thermal imaging

作　　者：刘晓光 余开 Liu Xiaoguang;Yu Kai(Brainware Terahertz Information Technology Co.,Ltd.,Hefei230088,China)

机构地区：[1]博微太赫兹信息科技有限公司,合肥230088

出　　处：《国外电子测量技术》2019年第4期121-124,共4页Foreign Electronic Measurement Technology

摘　　要：研制了基于高精度热电堆红外探测器的红外测温仪。测温仪采用FPGA作为处理器进行高速数据采集和实时温度计算,两片SDRAM作为高速数据缓存,Flash作为离线校正参数存储器,使用千兆以太网传输数据。在16bit ADC工作模式下,成像尺寸为32pixel×32pixel,最大热成像速率可达到60帧/s,与热电偶相比最大测温误差不超过±0.5℃。经过实际测试,本测温仪可以方便的对回流焊炉内的温度分布进行实时监测,同时由于其可快速反馈高精度温度测量数据,降低了温度曲线的跟随误差。A infrared thermometer based on high-precision thermopile infrared detector is designed.FPGA is used as processors for high-speed data acquisition and real-time temperature calculation,two SDRAMs are used as cache,Flash is used as parameter memory and Ethernet is used to transmit data.AD quantization accuracy reaches 16 bits,imaging size is 32×32 pixels.The maximum imaging rate can reach 60 frames/s,and the maximum temperature error after black body calibration is 0.38°C.Experiment shows the infrared thermometer can display temperature picture and reduces the follow-up error of temperature curve.

关 键 词：红外测温仪 回流焊炉 FPGA 热电堆红外探测器 

分 类 号：TN216[电子电信—物理电子学]