某高热密度密闭机箱散热设计  

Thermal Design of a Sealed Cabinet with a High Heat Density

作　　者：刘上 曹宁生[1] 马辰[1] 段晓峰 LIU Shang;CAO Ningsheng;MA Chen;DUAN Xiaofeng(China Ship Research Academy,Beijing 100101;The 32nd Research Institute of China Electronics Technology Group Corporation,Shanghai 201808)

机构地区：[1]中国舰船研究院,北京100101 [2]中国电子科技集团公司第三十二研究所,上海201808

出　　处：《舰船电子工程》2019年第6期182-187,共6页Ship Electronic Engineering

摘　　要：针对某高热密度密闭机箱,按流程开展热设计工作。以机箱内各模块热耗为输入条件,结构要求为边界条件,依次进行冷却方式的选择、模块的热安装、风道设计、热仿真分析、优化设计和试验验证。通过有力的数据支撑,充分论证了此次热设计方案的可行性,同时提高了该设备的可靠性,可为其他类似电子产品的热设计提供参考。The thermal design is made in a procedure for a sealed cabinet with a high heat density.Choosing the cooling method,fixing modules by heat,designing the air duct,thermal simulation,structural optimization and experimental verification are conducted in sequence, based on the heat of every module within the cabinet and dependent on structural requirements.The feasibility of the thermal project is sufficiently demonstrated by supportive and concrete data,and the reliability is improved in a same way.Other similar thermal design for e-products can refer to it.

关 键 词：热设计 加固机箱 高热密度 

分 类 号：TN305.94[电子电信—物理电子学]