ABS透明塑料低表面能基材粘接优化设计  

Optimization Design of Low Surface Energy Substrate Bonding for ABS Plastics

作　　者：孙会宁[1] 马家举[2] SUN Huining;MA Jiaju(Departmenrt of Material Engineering Mianyang Polytechnic,Mianyang,Sichuan 621000,China;Departmenrt of Chemistry Engineering Anhui University of Science and Techology,Huainan,Anhui 232001,China)

机构地区：[1]绵阳职业技术学院,材料工程系,四川绵阳621000 [2]安徽理工大学,化学工程学院,安徽淮南232001

出　　处：《塑料》2019年第3期23-25,41,共4页Plastics

摘　　要：介绍了 ABS 透明塑料基材的特性,测试出 ABS 透明塑料基材的表面能,针对 ABS 基材表面特性,分析了粘接过程中使用市售双组份胶黏剂粘接出现的问题,阐述了紫外光固化胶黏剂的优点,从 ABS 基材粘接用胶黏剂的选型、配方的研制、基材表面处理、涂布与粘接工艺、固化等方面进行优化设计。实验证明:采用自制的、无需配制的、直接使用的紫外光和热双重固化的胶黏剂,且预聚物和稀释剂配比保持在 52∶ 43,光引发剂含量为 3%,热引发剂含量为1. 5%,其表面能比市售胶黏剂降低了 11 mN/m,其粘接强度最佳,通过基材处理、改善粘接工艺,完善固化条件,克服氧阻聚,提高固化度等,使 ABS 透明塑料基材粘接强度达到 18 MPa 以上。The characteristics of ABS transparent plastic substrates were introduced in this paper. The surface energy of ABS transparent plastic substrates were tested,and the problems in the use of commercially available two-group adhesive adhesives in the bonding process were analyzed. The advantages of ultraviolet photocemented adhesives were described. Optimal design was carried out from the selection of adhesive for ABS substrate bonding,formulation development,surface treatment of substrate,coating and bonding process,curing. The experimental results showed that: the use of a self-mading, direct-used ultraviolet and heat-curing adhesive,and pre-polymer and diluent ratio was 52∶ 43,light initiator was 3%,thermal initiator was 1. 5 %. The surface energy was reduced by 11 mN/m,compared to the market adhesive,and the adhesion strength was the best. Through the treatment of substrate,improving the bonding process,improving the curing conditions, overcoming oxygen blocking polymerization,and improving the degree of consolidation,The adhesion strength of ABS transparent plastic substrate reacheed 18 MPa or more.

关 键 词：ABS 塑料基材 粘接 光固化 低表面能 

分 类 号：TQ325.2[化学工程—合成树脂塑料工业]