氮化硼填充导热绝缘塑料的研究及应用  

Research and Application of Boron Nitride Filled Thermal Conductive and Electrical Insulating Plastics

作　　者：张惠娟 王涛 孟维晓 瞿雄伟[1] ZHANG Hui-juan;WANG Tao;MEMG Wei-xiao;QU Xiong-wei(National-Local Joint Engineering Laboratory for Energy Conservation in Chemical Process Integration and Resources Utilization,School of Chemical Engineering and Technology,Hebei University of Technology,Tianjin 300130,China;Department of Management of State-Owned Assets,Hebei University of Science and Technology,Shijiazhuang,050018,China)

机构地区：[1]河北工业大学化工学院化工节能过程集成与资源利用国家地方联合工程实验室,天津300130 [2]河北科技大学资产管理处,河北石家庄050018

出　　处：《塑料工业》2019年第6期22-26,共5页China Plastics Industry

基　　金：河北省自然科学基金资助(E2016202036);国家自然科学基金资助(51573037)

摘　　要：六方氮化硼(h-BN)由于其高的导热系数和良好的电绝缘性能在学术界和工业界都受到了广泛的关注。以其作为导热填料制备导热绝缘塑料是近年来研究者的重点研究方向。介绍了氮化硼填充的聚合物基复合材料导热性能的影响因素,包括氮化硼的表面功能化、填料混杂、塑料基体以及填料在基体中的取向。此外,还介绍了氮化硼/聚合物复合材料在电子领域的应用情况。Hexagonal boron nitride(h-BN)received extensive attention in both academia and industry,due to its high thermal conductivity and good electrical insulation properties.In recent years,preparation of thermal conductive and electrical insulation plastics filled with BN as thermally conductive filler had become a hot research object.Many factors could affect the thermal conductivity of the BN filled polymer-based composites,including surface modification of BN,hybrid fillers,plastic matrix and orientation of BN sheets in the matrix.In addition,the application of BN/polymer composites in the field of electronics was also introduced.

关 键 词：氮化硼 导热性能 塑料基体 绝缘性 

分 类 号：TQ314.261[化学工程—高聚物工业]