脉冲周期对黄金电沉积层的影响（英文）  

Influence of Pulse Period of Bidirectional Pulse Electrodeposition Process on the Properties of Electroformed Layer of Gold

作　　者：郑利珊 袁心强[1] 雷婷 Zheng Lishan;Yuan Xinqiang;Lei Ting(China University of Geosciences, Wuhan 430074,China;Wuhan University of Engineering Science, Wuhan 430200,China)

机构地区：[1]中国地质大学(武汉),湖北武汉430074 [2]武汉工程科技学院,湖北武汉430200

出　　处：《稀有金属材料与工程》2019年第6期1797-1802,共6页Rare Metal Materials and Engineering

基　　金：Gemmological Institute China University of Geosciences(Wuhan)Open Fund(CJHIXM-S201615)

摘　　要：在无氰黄金电沉积工艺的基础上,利用双向脉冲电源,经过20 h的电沉积可以得到质量较好的厚度达150μm的黄金样品。通过以脉冲周期为单一变量实验,研究了脉冲周期对黄金电沉积层的影响,利用扫描电镜、X射线衍射仪以及维氏硬度计探讨了黄金电沉积层的微观形貌、平均晶粒尺寸以及维氏硬度。结果显示,当脉冲周期为45~75 ms时,电沉积层的维氏硬度HV0.1较高,最高可以达到1170 MPa,且电沉积层具有较强的(111)晶面的择优取向。较强的(111)晶面择优取向伴随着电沉积层更加平整的微观形貌以及更高的维氏硬度。Electroformed gold layers were prepared by bidirectional pulse electrodeposition process, with thickness up to 150 μm in 20 h from cyanide-free bath. Through a single variable experiment, in which the pulse period was treated as a single variable, we studied the effect of pulse period on the properties of electroformed layer of gold using bidirectional pulse power. Scanning electron microscopy, X-ray diffraction, and Vickers hardness test were used to research the surface morphology, average crystal size and hardness of electroformed gold layers. Results show that the microhardness of electroformed layer of gold is higher when pulse period changes between 45 and 75 ms, which can reach to 1170 MPa. Strong(111) preferred orientation can result in flatter micro surface and higher microhardness of electroformed gold layers.

关 键 词：双向脉冲 脉冲周期 黄金 维氏硬度 无氰电沉积 

分 类 号：TQ153.18[化学工程—电化学工业]