钴离子和镍离子用量对电镀硬金层显微硬度和电接触性能的影响  

Effects of the dosages of cobalt and nickel ions on microhardness and electrical contact performance of electroplated hard gold coating

作　　者：杜岩滨 李卫平[2] 朱立群[2] DU Yan-bin;LI Wei-ping;ZHU Li-qun(Sunway Caike Communication Technology (Beijing) Co., Ltd., Beijing 100176, China)

机构地区：[1]信维创科通信技术(北京)有限公司,北京100176 [2]北京航空航天大学材料科学与工程学院,北京100083

出　　处：《电镀与涂饰》2019年第13期637-640,共4页Electroplating & Finishing

基　　金：国家自然科学基金(U1637204);国家重点研发计划(2018YFB2002002)

摘　　要：为了在提高零件表面金层硬度的同时不降低表面电接触性能,在普通镀金液中加入0.2~0.6g/L钴或0.1~0.5g/L镍离子,电镀得到了金黄色的Au.Co合金镀层(Co质量分数为0.1%~0.7%)和Au.Ni合金镀层(Ni质量分数为0.2%~1.6%),其显微硬度分别为150~190HV和170~250HV。2种硬金层都均匀、细致,结合力良好,接触电阻低于2mΩ。降低黄铜基体的表面粗糙度有利于降低硬金层的接触电阻。To improve the hardness of a component without reducing its surface electrical contact performance, 0.2-0.6 g/L of cobalt ions or 0.1-0.5 g/L of nickel ions were added to a normal gold electroplating bath, from which an Au?Co alloy coating containing 0.1-0.7wt.% Co or an Au?Ni alloy coating containing 0.2-1.6wt.% Ni in golden color was obtained. The microhardness was 150-190 HV for the former and 170-250 HV for the latter. Both hard gold coatings were uniform and compact with a good adhesion, and a contact resistance 2 mΩ below. The decrease in surface roughness of brass substrate facilitated to reduce the contact resistance of hard gold coatings.

关 键 词：黄铜 电镀 硬金 金.钴合金 金.镍合金 显微硬度 接触电阻 

分 类 号：TQ153.2[化学工程—电化学工业]