TC4钛合金基体无氰镀铜工艺及镀铜层的性能  

Cyanide-Free Copper Electroplating Process for TC4 Titanium Alloy Substrate and Properties of Copper Coating

作　　者：尚长沛[1] 张松泓 张家瑞[2] SHANG Changpei;ZHANG Songhong;ZHANG Jiarui(Henan Polytechnic Institute,Nanyang 473009,China;Henan University of Science and Technology,Luoyang 471000,China)

机构地区：[1]河南工业职业技术学院,河南南阳473009 [2]河南科技大学,河南洛阳471000

出　　处：《电镀与环保》2019年第4期7-9,共3页Electroplating & Pollution Control

基　　金：河南省重大科技专项项目(181100110100)

摘　　要：研究了TC4钛合金基体无氰镀铜工艺。采用扫描电镜、显微硬度计和材料表面性能测试仪,通过摩擦学性能指标、磨痕形貌和磨损面化学成分分析,比较了钛合金基体与镀铜层的耐磨性。结果表明:在相同的摩擦试验条件下,镀铜层的磨损率相对于钛合金基体的磨损率降低了一个数量级,平均摩擦因数减小到0.42左右。钛合金基体与镀铜层的磨损形式截然不同。由于镀铜层能起到减摩作用,所以无氰镀铜可以改善和提高钛合金基体的耐磨性。Cyanide-free copper electroplating process for TC4 titanium alloy substrate was studied.By scanning electron microscope,microhardness tester and material surface performance tester,the wear resistance of titanium alloy substrate and copper coating was compared through the analysis of tribological performance index,wear scar morphology and chemical composition of wear surface.The results showed that the wear rate of copper coating was an order of magnitude lower than that of titanium alloy substrate,and the average friction coefficient decreased to about 0.42.The wear form of titanium alloy substrate and copper coating was greatly different.Copper coating play the role of reducing the friction,therefore,cyanide-free copper electroplating on titanium alloy substrate can improve the wear resistance of titanium alloy substrate.

关 键 词：TC4钛合金基体 无氰镀铜工艺 磨损率 磨痕形貌 

分 类 号：TQ153[化学工程—电化学工业]