电化学高端制造技术-铜增材在结晶器铜件上的应用  

High-end electrochemical manufacturing technology-application of copper augmentation in mould copper parts

作　　者：郝步东 HAO Bu-dong(Deyang Dngsheng advanced material technology Co.,Ltd., Deyang 618029,Sichuan,China)

机构地区：[1]德阳东合新材料科技有限公司,四川德阳618029

出　　处：《连铸》2019年第3期14-18,共5页Continuous Casting

摘　　要：电化学铜增材再制造技术是一种可用于结晶器再制造的新技术新工艺。常温常压、电场作用下,金属铜盐、硬质纳米颗粒等组成的水溶液中的铜离子在阴极进行沉积,同时铜离子将硬质纳米颗粒包埋进金属铜,形成铜基纳米复合材料。Electrochemical copper additive remanufacturing technology is a new technology which can be used in mold remanufacturing. Copperons in the aqueous solution composed of copper salts and hard nanoparticles are deposited at the cathode under the action of normal temperature,pressure and electric field. At the same time,copper ions embed the hard nanoparticles into the metal copper to form copper-based nanocomposites.

关 键 词：电化学 铜增材 硬质纳米颗粒 纳米复合材料 再制造 

分 类 号：TF341.6[冶金工程—冶金机械及自动化]