Cu/Al复合带高温短时退火的组织与性能演变  

Microstructure and Property Evolution of Cu/Al Composite Strip During High-temperature Short-time Annealing

作　　者：张建宇[1] 陈庆安[1] 王艳辉 李河宗[1] 吴春京[2] Zhang Jianyu;Chen Qing’an;Wang Yanhui;Li Hezong;Wu Chunjing(Hebei University of Engineering, Handan 056038, China;University of Science and Technology Beijing, Beijing 100083, China)

机构地区：[1]河北工程大学,河北邯郸056038 [2]北京科技大学,北京100083

出　　处：《稀有金属材料与工程》2019年第7期2193-2202,共10页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51274038);河北省高等学校科学技术研究项目(QN2018078)

摘　　要：将冷轧法制备的Cu/Al复合带在温度475~525℃下退火1~8 min,采用有限元软件模拟了Cu/Al复合带在退火过程中的温度场,并采用扫描电镜(SEM)、X射线衍射(XRD)仪、能谱(EDS)仪、电子背散射衍射(EBSD)、显微硬度计等检测手段研究了Cu/Al复合带的显微组织与力学性能。结果表明:在Cu/Al复合界面依次生成了CuAl2、Cu9Al4和CuAl等3种金属间化合物,在Cu/Al界面金属间化合物层厚度小于4μm的退火工艺范围内,Cu和Al基体发生完全再结晶形成等轴晶并且Cu、Al基体的显微硬度能够迅速的降低至低温长时间(350℃/1h)退火的硬度。另外,提出了金属间化合物初生相的形核机理,分析计算了高温短时退火工艺下的形核动力学,并提出了非等温条件下金属间化合物生长厚度的经验数值方法。The cold-rolled Cu/Al composite strip was annealed at 475~525 °C for 1~8 min, the temperature field of the Cu/Al composite strip during annealing was simulated by finite element software, and the microstructures and properties of the Cu/Al composite strip were investigated by scanning electron microscopy(SEM), energy dispersive X-ray spectrometry(EDS), X-ray diffractometer(XRD), electron back-scattered diffraction(EBSD) and microhardness tester. The results indicate that three intermetallic compounds(IMCs), CuAl2, Cu9 Al4 and CuAl phases form successively at the Cu/Al interface, within the annealing process scope in which the thickness of IMCs layer is smaller than 4 μm, complete recrystallization of both the Cu and Al matrix takes place to form equiaxed grains and the microhardness of Cu and Al matrix drops fast to approach that of annealing at 350 °C for 1 h. Furthermore, the nucleation mechanism of first phase was proposed and the nucleation kinetics of IMCs during high-temperature short-time annealing was analyzed and calculated, and an empirical numerical method was proposed to calculate the thickness of IMCs during the non-isothermal annealing process.

关 键 词：Cu/Al复合带 退火 高温短时 形核机理 金属间化合物厚度 

分 类 号：TG335.85[金属学及工艺—金属压力加工]