基于SLS的填充型导电复合材料电学性能模拟与实验研究  

Simulation and Experimental Study on Electrical Properties of Filled Conductive Polymers Based on SLS

作　　者：吴海华[1] 王俊[1] 任超群 陈奎 孙瑜[1] 李立军[1] Wu Haihua;Wang Jun;Ren Chaoqun;Chen Kui;Sun Yu;Li Lijun(Hubei Key Laboratory of hydroelectric mechanical equipment design and maintenance,China Three Gorges University,Yichang,Hubei 443002,China)

机构地区：[1]三峡大学水电机械设备设计与维护湖北重点实验室

出　　处：《应用激光》2019年第3期495-501,共7页Applied Laser

基　　金：国家自然科学基金资助项目(项目编号:51575313);湖北省自然科学基金资助项目(项目编号:20147CFB678)

摘　　要：针对传统的填充型导电复合材料内部导电网络难以精确构造问题,首次将选择性激光烧结成型技术应用于填充型导电复合材料成型中,首先利用选择性激光烧结成型技术快速制备多孔石墨骨架,然后利用热压成型工艺实现多孔石墨骨架与酚醛树脂基体的复合,获得了新型填充型导电复合材料。研究了Y字型类蜂窝多孔石墨骨架基本特征结构参数对新型填充型导电复合材料电学性能影响,给出新型填充型导电复合材料Z方向电阻率计算模型,最后设计实验进行验证。研究表明,新工艺是可行的,通过改变基本特征单元结构参数即可改变新型填充型导电复合材料内部导电通路数量及并串联方式,实现了对新型填充型导电复合材料电学性能的主动调控,这为填充型导电复合材料制备提供了新方法。It is difficult to accurately construct the internal conductive network of the traditional filled conductive polymers. For the first time, the selective laser sintering is applied to fabricate filled conductive polymers. Firstly, porous graphite skeleton is rapidly prepared by selective laser sintering technology, and then the composite of porous graphite matrix and phenolic resin matrix is realized by hot pressing forming process, and a new type of filled conductive polymers is obtained. The influence of the basic characteristic structure parameters of Y-shaped honeycomb porous graphite skeleton on the electrical properties of the new filled conductive polymers is studied. The Z-direction resistivity calculation model of the new filled conductive polymers is presented and verified by the design experiment. The results show that the new process is feasible. By changing the structure parameters of the basic characteristic unit, the number of internal conductive paths and the parallel series mode of the new filled conductive polymers can be changed, and the active regulation of the electrical properties of the new filled conductive polymers is realized. This provides a new method for the preparation of filled conductive polymers.

关 键 词：填充型导电复合材料 多孔石墨骨架 电学性能 模拟分析 实验研究 

分 类 号：TM242[一般工业技术—材料科学与工程] TN249[电气工程—电工理论与新技术]