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作 者:吴世林 杨庆[1] 邵涛[2] Wu Shilin;Yang Qing;Shao Tao(State Key Laboratory of Power Transmission Equipment & System Security and New TechnologyChongqing University Chongqing 400030 China;Institute of Electrical Engineering Chinese Academy of Sciences Beijing 100190 China)
机构地区:[1]重庆大学输配电装备及系统安全与新技术国家重点实验室,重庆400030 [2]中国科学院电工研究所,北京100190
出 处:《电工技术学报》2019年第16期3494-3503,共10页Transactions of China Electrotechnical Society
基 金:国家自然科学基金资助项目(51277190和51877205)
摘 要:在强电场作用下电极材料向液体电介质注入一定量的空间电荷,会造成电场畸变,影响液体电介质绝缘性能。为了探究低温等离子体改性电极对液体电介质绝缘性能的影响,采用真空溅射镀膜法分别对铝、铜和不锈钢三种电极材料溅射TiO2对其表面进行改性,测试改性前后液体电介质的击穿电压,并利用Kerr电光效应测量了改性前后三种电极材料向液体电介质注入空间电荷的分布情况。结果表明,在铝、铜和不锈钢三种电极材料表面改性后,液体电介质的击穿电压有明显的提高,提升幅度依次分别为6.7%、4.1%和9.0%。溅射的TiO2膜增加了铝和铜电极表面屏蔽层,削弱了阴极的电场畸变,导致注入液体空间电荷量的降低;其次溅射过程中产生的粒子撞击电极改变了电极表面的微观结构,不锈钢电极下液体电介质形成了双极电荷注入。The space charge is injected into the liquid by the electrode materials under a strong electric field,which causes electric field distortion and affects the insulation properties of the liquid.In this paper,in order to investigate the effect of surface-modified electrode by low temperature plasma on charge injection of liquid dielectric,the surface of aluminum,copper and stainless steel was sprayed with TiO2 by vacuum sputtering coating method.The breakdown voltage of the liquid dielectric was tested and the distribution of space charge in the liquid dielectric was also measured by Kerr electro-optic effect before and after modification.The results show that the breakdown voltage of the liquid dielectric increases after the surface modification of aluminum,copper and stainless steel,the increase rates are 6.7%,4.1%and 9.0%,respectively.The sputtered titanium dioxide film increases the surface shielding layer of the aluminum and copper electrodes,which weakens the electric field distortion of the cathode,resulting in a reduction in the amount of space charge injected into the liquid.Furthermore,the liquid dielectric under the stainless-steel electrode forms a bipolar charge injection,because the particles generated during the sputtering process hit the electrode to change the microstructure of the electrode surface.
分 类 号:TM214[一般工业技术—材料科学与工程]
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