电子产品可靠性评价与物理模型应用探讨  

Study on Reliability Evaluation and Physical Model of Electronic Products

作　　者：支越[1] 孙大鹏 王之哲 罗宏伟[1] ZHI Yue;SUN Dapeng;WANG Zhizhe;LUO Hongwei(The Fifth Institute of Electronics of Ministry of Industry and Information Technology, Guangzhou 510610, China)

机构地区：[1]工业和信息化部电子第五研究所

出　　处：《压电与声光》2019年第4期613-616,共4页Piezoelectrics & Acoustooptics

基　　金：国家自然科学基金资助项目(61804032);广州市科技计划基金资助项目(201904010457)

摘　　要：该文以电子产品的故障为出发点,从集成电路-封装、集成电路-芯片、电路板(或线路板)、电子元件、系统和多系统的角度论述了不同任务环境下电子器件的故障机理特点。系统论述了故障模式、影响及危害性分析(FMECA)和故障模式、机理与影响分析(FMMEA)两种故障机理分析方法,同时结合低周疲劳、高周疲劳、裂纹萌生、反应论模型、芯片失效等失效机理对故障物理元模型进行分类讨论,对电子产品可靠性评价与物理模型应用进行了系统的探讨,为电子产品可靠性评价及失效物理评估模型的选取提供了依据。In this paper, the failure mechanism characteristics of electronic devices under different service environments for package, chip, circuit board, electronic components, systems and multiple systems are discussed. The analytical methods for failure mechanisms such as FMECA and FMMEA have been studied. The failure physical models are classified and discussed in combination with failure mechanisms such as low cycle fatigue, high cycle fatigue, crack initiation, reaction theory model, and chip failure. The reliability evaluation of electronic products and the application of physical models are systematically discussed, which provides a basis for the reliability evaluation of electronic products and the selection of failure physical models.

关 键 词：电子产品 可靠性 故障机理分析 失效物理 

分 类 号：TN60[电子电信—电路与系统] V461[航空宇航科学与技术—航空宇航制造工程]