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作 者:韩代云[1] 李源彬[2] HAN Daiyun;LI Yuanbin(Department of Information Engineering, Sichuan Technology & Business College, Dujiangyan 405408, China;College of Information Engineering,Sichuan Agricultural University,Yaan 625014,China)
机构地区:[1]四川工商职业技术学院机电工程系,四川都江堰405408 [2]四川农业大学信息工程学院,四川雅安625014
出 处:《功能材料》2019年第9期9170-9173,9180,共5页Journal of Functional Materials
基 金:国家自然科学基金资助项目(60373110)
摘 要:将镍基石墨烯薄膜应用在IGBT模块散热方面,提出了镍基石墨烯薄膜的制备工艺,并利用扫描电镜、透射电镜、能谱仪等对镍基石墨烯薄膜进行表征。结果表明,当电流密度为2 A/dm^2时,镍基石墨烯薄膜中的有大量的Ni和C元素,镍基石墨烯薄膜中的石墨烯平均粒径为32.5 nm。当脉冲电流密度为1 A/dm^2时,镍基石墨烯薄转移镍基石墨烯薄膜后的S1芯片的散热效果较好。当脉冲电流密度为2 A/dm^2时,镍基石墨烯薄转移镍基石墨烯薄膜后的S2芯片的散热效果最好,其最大散热量为14.9℃。In this paper, nickel-based graphene film was applied to solve the heat dissipation of IGBT module. The nickel-based graphene film was characterized by scanning electron microscopy(SEM), transmission electron microscopy(TEM) and energy dispersive spectroscopy(EDS). The results show that when the current density was 2 A/dm^2, there were a lot of Ni and C elements in nickel-based graphene film, and the average particle size of graphene in nickel-based graphene film was 32.5 nm. When the pulse current density was 1 A/dm^2, the heat dissipation effect of S1 chip with nickel-based graphene thin-film was better. When the pulse current density was 2 A/dm^2, the heat dissipation effect of S2 chip with nickel-based graphene thin-film transfer was the best, and the maximum heat dissipation was 14.9 ℃.
分 类 号:TN305.94[电子电信—物理电子学]
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