电感器漆包线热压焊界面可靠性分析  

Analysis on reliability of hot-press welding interface of enameled wire in inductors

作　　者：王东 王上衡 吴猛雄 朱建华 陆松杰 陈宏涛 WANG Dong;WANG Shang-heng;WU Meng-xiong;ZHU Jian-hua;LU Song-jie;CHEN Hong-tao(Shenzhen Zhenhua Fu Electronics Co,Ltd,Shenzhen 518109,China;School of Materials Science and Engineering,Harbin Institute of Technology Shenzhen,Shenzhen 518055,China)

机构地区：[1]哈尔滨工业大学(深圳)材料科学与工程学院,广东深圳518055 [2]深圳振华富电子有限公司,广东深圳518109

出　　处：《磁性材料及器件》2019年第5期18-22,共5页Journal of Magnetic Materials and Devices

摘　　要：利用全自动绕线机制备电感器,由金相显微镜、电子万能试验机、SEM、EDS和BSE分析了漆包线焊接界面的宽度、焊点强度、界面形貌以及界面元素分布。结果表明,焊接温度和焊接时间对焊点处漆包线宽度的影响较小,但是会影响漆包线的去除效果;焊接压力对焊点的影响较大。焊接界面的的微观形貌观察和界面处的元素分布分析表明,不同材料的焊接界面以机械形式结合,Cu及金层的扩散距离计算可以进一步验证界面处的结合形式。本研究对热压焊的焊接参数、焊接强度和可靠性进行深入研究,为后续的设备改进和工艺参数的制定提供理论指导。Inductors were prepared using a fully-automatic winding machines. The optical microscopy, electronic universal testing machines, SEM, EDS and BSE were used to analyze the interface width, joint strength, interface morphology and interface element distribution. The results show that the welding temperature and time have little effect on the width of the enameled wire at the joint strength, but it will affect the removal efficiency of organic matter of enameled wire. The welding pressure has a great influence on the solder joint. The microstructure of the welding interface and the element distribution at the interface can be learned that the welding interfaces of different materials are combined in a mechanical manner. Calculation of the diffusion distance of Cu and gold layers can further verify the bonding form at the interface. In this study, the parameters, strength and reliability of hot-press welding were studied in-depth to provide theoretical guidance for the subsequent equipment improvement and the formulation of process parameters.

关 键 词：电感器 漆包线 热压焊 焊点强度 界面分析 

分 类 号：TM55[电气工程—电器]