谈局部厚铜板的制作流程  

Production process for PCB with thick copper on partly area

作　　者：蒋华 张宏 何艳球 张亚锋 郭宇 Jiang Hua;Zhang Hong;He Yanqiu;Zhang Yafeng;Guo Yu

机构地区：[1]胜宏科技(惠州)股份有限公司,广东惠州516211

出　　处：《印制电路信息》2019年第10期51-56,共6页Printed Circuit Information

摘　　要：局部厚铜板在生产过程中,需要重点管控局部厚铜板的蚀刻深度、半固化片(PP)开窗尺寸设计及残胶、底片曝光的吸真空度及压合失压、缺胶、铜箔起皱等问题。文章主要通过对局部厚铜板的生产流程进行研究,并总结出一种能适合此类型板批量生产的制作流程。In the production process of PCB with partly thick copper,it is necessary to focus on controlling the etching depth of partly thick copper,Pp opening size design and residual resin,vacuum absorption and pressure loss of film exposure,lack of resin,copper foil wrinkling and other problems.This paper mainly studies the production process of PCB with partly thick copper,and summarizes a production process which is suitable for the mass production of thistype of PCB.

关 键 词：局部厚铜 控深蚀刻 压合 曝光 汽车板 

分 类 号：TN41[电子电信—微电子学与固体电子学]