小尺寸芯片电容加工工艺研究  

Research on Processing Technology of Small Size Chip Capacitor

作　　者：徐亚新[1] 梁广华[1] 魏浩 赵飞[1] 庄治学 周拥华 何超 XU Yaxin;LIANG Guanghua;WEI Hao;ZHAO Fei;ZHUANG Zhixue;ZHOU Yonghua;HE Chao(The 54th Research Institute of CETC,Shijiazhuang 050081,China)

机构地区：[1]中国电子科技集团公司第五十四研究所

出　　处：《电子工艺技术》2019年第5期288-290,共3页Electronics Process Technology

摘　　要：研究了小尺寸芯片电容的仿真以及加工工艺,分析了芯片电容的边界效应,优化了加工过程中的关键工艺。在此基础上加工出一种小尺寸芯片电容,并进行了性能测试,达到了使用要求,对小尺寸芯片电容的加工制造具有较好的借鉴意义。The simulation and processing of small-scale chip capacitors are studied,the boundary effect of the chip capacitors is analyzed,and the key process is optimized.On this basis,a small chip capacitor is fabricated and its performance is tested,which meets the requirements of application and has a good reference for the manufacturing of small-scale chip capacitors.

关 键 词：芯片电容 边界效应 划切 

分 类 号：TN605[电子电信—电路与系统]