空心玻璃微珠改性环氧树脂印刷电路板基材  

Hollow Glass-Bead Modified Epoxy Resin for Printed Circuts

作　　者：杨庆泉[1] 李齐方[1] 王静[1] 张立群[1] 

机构地区：[1]北京化工大学教育部可控化学反应技术基础实验室,北京100029

出　　处：《中国塑料》2002年第11期52-56,共5页China Plastics

基　　金：北京市科技新星计划编号 :95 5 810 12 0 0

摘　　要：对用于印刷电路板的环氧树脂 /空心玻璃微珠复合体系的热性能、力学性能、亚微观形态和吸水性进行了系统的研究。实验表明 :用空心玻璃微珠填充环氧树脂可提高后者的热性能和力学性能 ,尤其加入较小粒径的玻璃微珠 ,环氧树脂体系的Tg 最高可提高 5℃ ;用偶联剂对玻璃微珠表面进行处理 ,并向体系内加入表面活性剂可获得最佳效果 ;少量地加入玻璃微珠可降低环氧树脂的吸水性 ,但随着玻璃微珠含量的增大体系的吸水性会随之增加。加入表面活性剂后 。Sub-micro-morphology, mechanical properties, thermal properties and water absorption of epoxy /hollow glass-bead blend for printed circuto were studied systematically. The results showed that, incorporation of hollow glass-beads into the system improved the mechanical properties and the thermal properties of epoxy resin. Especially, using smaller size of glass-beads, the T g of the blend can be increased by 5 ℃. If glass-beads were treated with the coupling agent and surfactant was added into the blend,the system obtained the optimum properties. Adding a few glass-beads into epoxy resin decreases the water-absorption of the blend, however, with the increase of the glass-bead contents, the water-absorption of the blend increases. After the surfactant was added, the system kept low water-absorption.

关 键 词：空心玻璃微珠 改性 环氧树脂 印刷电路板 基材 力学性能 热性能 亚微观相态 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]