电沉积铜的工艺参数对镀层硬度及电阻率的影响  

Effect of Process Variable on Hardness of Electrodepositing Copper Coating

作　　者：姜力强[1] 郑精武[1] 何强斌 李华[1] 

机构地区：[1]浙江工业大学材料科学研究所,浙江杭州310014

出　　处：《材料保护》2002年第11期26-27,共2页Materials Protection

基　　金：科技部地方重大科技攻关项目资助

摘　　要：通过改变镀铜工艺中的阴极电流密度参数 ,测定所获得镀铜层的硬度及电阻率 ,发现阴极电流密度与镀铜层的硬度及电阻率之间的变化趋势 ,硬度与电阻率的时间效应。The hardness and resistivity of copper electroplating under various cathodic current densities were measured. The relations between the current density and hardness and resistivity, as well as the effects of time were discussed. And the results were explained theoretically.

关 键 词：电沉积铜 工艺参数 镀层 硬度 电阻率 影响 

分 类 号：TQ153.1[化学工程—电化学工业]