Al-Si-Cu-Ni低熔点钎料中合金元素对其性能的影响  

INFLUENCE OF ALLOYING ELEMENT TO PROPERTY IN Al-Si-Cu-Ni LOW MELTING-POINT SOLDER

作　　者：于文花[1] 朱颖[1] 康慧[1] 曲平[1] 胡刚[2] 

机构地区：[1]北京航空航天大学,100083 [2]北京航空制造工程研究所,100024

出　　处：《焊接》2002年第11期21-23,36,共4页Welding & Joining

摘　　要：Al-Si钎料因具有良好的润湿性、流动性、钎焊接头的抗腐蚀性和可加工性 ,应用非常广泛 ,但其熔点较高 ,很难用于低熔点的铝合金的钎焊。以Cu、Ni作为主要的添加元素 ,通过正交试验的方法研究了合金元素Cu、Ni、Si对铝基钎料熔点的影响。结果表明 ,影响的主次顺序为Cu、Si、Ni ,同时得出 :随着合金元素Cu、Si的含量的增大 ,其熔点大大降低 ;合金元素Ni的含量对钎料熔点的影响较小。钎料Al-2 0Cu -3.3Ni-10Si的熔点最低 ,达到5 35 .8℃ 。In this paper, Cu and Ni are chosen to be added to Al-base solder and the effects of Cu, Si and Ni on the melting-point of solder are studied by Probability&Statistic design. The study results show that the melting-point of new designed solder decreases markedly when the content of Cu or Si increases, and the effect of Ni on the melting-point of solder is little. The melting-point of Al-20Cu-3.3Ni-10Si solder is 535.8 ℃, the lowest one in the Al-Cu-Ni-Si solder. And the spreadability of this kind of solder is very good.

关 键 词：合金元素 铝基钎料 低熔点 真空钎焊 铺展性能 

分 类 号：TG425[金属学及工艺—焊接]