数值计算模拟复合材料固化中夹杂气泡的影响和残余应力的变化  

MODULATING VOID ACTION AND RESIDUAL STRESS VARIATION OF COMPOSITE MATERIALS DURING CURING PROCESS

作　　者：王荣国[1] 田秋 马文有 代成琴[3] 田丰 陈玉金 李辰砂[1] 曹茂盛 

机构地区：[1]哈尔滨工业大学材料科学与工程学院,哈尔滨150006 [2]哈尔滨工程大学材料系,哈尔滨150001 [3]黑龙江省信息中心,哈尔滨150030 [4]黑河出入境检验检疫局,黑河164300

出　　处：《复合材料学报》2002年第5期95-101,共7页Acta Materiae Compositae Sinica

基　　金：国防科工委九五预研项目

摘　　要：复合材料的固化有着复杂的内部过程 ,传统的工艺条件难以保障产品的质量。影响复合材料成型质量的主要因素为树脂基体内的气泡的增长和各铺层之间的残余应力 ,本文作者分析气泡和残余应力形成的机理 ,建立过程模型 ,并编制计算机程序模拟计算气泡的增长和残余应力的形成 。It is difficult to insure the quality of composites for the reason that there are complicated processes during the curing process of composites. Void action and residual stress act as the main actors of influencing the quality of composite products. In this paper, the formation principles of void and residual stress are analyzed. The process model is established. The computer code is made to calculate the void growth and the residual stress formation. The results of computation can be used as the base for the design of the composite curing process.

关 键 词：数值计算模拟 复合材料 固化 气泡 残余应力 热固性树脂 纤维增强层合结构 

分 类 号：TB332[一般工业技术—材料科学与工程]